Article
Metallic Thin Film Growth on Vicinal Cu Substrates
Surface Science
(2010)
Abstract
In this study we have investigated the heteroepitaxial growth of nickel and silver on vicinal copper substrates. Nickel was deposited onto a (211) substrate. The low lattice mismatch between copper and nickel of 2.5% enables epitaxial bidimensional growth in the substrate's orientation, where the strain can be accommodated in the overlaying film. On the contrary, copper and silver have a much larger mismatch of about 13% which usually cannot be accommodated in the film. In general, Ag is known to form alloys or to induce faceting on a stepped Cu surfaces. Here, silver was deposited onto a Cu(311) facet covered with a monatomic layer of NaCl. For the first time we show that Ag can be grown as ultrathin film in the substrates's orientation on a stepped surface using NaCl as a novel surfactant material.
Keywords
- Vicinal single-crystal surfaces,
- Metallic films,
- Copper,
- Nickel,
- Silver,
- LEED,
- STM
Disciplines
Publication Date
November, 2010
Publisher Statement
Copyright © 2010 Elsevier B.V. All rights reserved. DOI: 10.1016/j.susc.2010.09.008
Citation Information
Andreas Riemann, Benjamin N. Satterwhite and Brandon E. Owens. "Metallic Thin Film Growth on Vicinal Cu Substrates" Surface Science Vol. 604 Iss. 23-24 (2010) Available at: http://works.bepress.com/andreas_riemann/4/