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A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper
Acta Materialia (2009)
  • Travis L. Brown, Purdue University
  • Christopher Saldana, Purdue University
  • Tejas G. Murthy, Purdue University
  • James B. Mann, Purdue University
  • Yang Guo, Purdue University
  • Larry F. Allard, Oak Ridge National Laboratory
  • Alexander H. King, The Ames Laboratory
  • W. Dale Compton, Purdue University
  • Kevin P. Trumble, Purdue University
  • Srinivasan Chandrasekar, Purdue University
Abstract

The deformation field in machining was controlled to access a range of deformation parameters—strains of 1–15, strain rates of 10–100,000 s−1 and temperatures of up to 0.4 Tm—in the severe plastic deformation (SPD) of copper. This range is far wider than has been accessed to date in conventional SPD methods, enabling a study of the interactive effects of the parameters on microstructure and strength properties. Nano-twinning was demonstrated at strain rates as small as 1000 s−1 at −196 °C and at strain rates of ⩾10,000 s−1 even when the deformation temperature was well above room temperature. Bi-modal grain structures were produced in a single stage of deformation through in situ partial dynamic recrystallization. The SPD conditions for engineering specific microstructures by deformation rate control are presented in the form of maps, both in deformation parameter space and in terms of the Zener–Hollomon parameter.

Keywords
  • Severe plastic deformation,
  • High speed deformation,
  • Dynamic recrystallization,
  • Copper,
  • Ultrafine grained microstructure
Publication Date
October, 2009
Citation Information
Travis L. Brown, Christopher Saldana, Tejas G. Murthy, James B. Mann, et al.. "A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper" Acta Materialia Vol. 57 Iss. 18 (2009)
Available at: http://works.bepress.com/alex_king/58/