Ultrafine-grained metals have impressive strength but lack the thermal stability necessary for most applications. Nano-scale, deformation twinned copper microstructures exhibit a rare combination of strength and stability. While storing less energy in their interfaces than other nanostructured metals, they also exhibit lower vacancy supersaturations, reducing the driving force and mobility for microstructure evolution. From a thermal stability perspective, the nano-twinned microstructure may thus be preferred over the more commonly produced nano-scale equiaxed microstructures.