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Creep behavior of copper-chromium in-situ composite
Metallurgical and Materials Transactions A
  • K. L. Lee, University of Leicester
  • A. F. Whitehouse, University of Leicester
  • S.I. Hong, Chungnam National University
  • Alan M. Russell, Iowa State University
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Creep deformation and fracture behaviors were investigated on a deformation-processed Cu-Cr in-situ composite over a temperature range of 200 °C to 650 °C. It was found that the creep resistance increases significantly with the introduction of Cr fibers into Cu. The stress exponent and the activation energy for creep of the composite at high temperatures (≥400 °C) were observed to be 5.5 and 180 to 216 kJ/mol, respectively. The observation that the stress exponent and the activation energy for creep of the composite at high temperatures (≥400 °C) are close to those of pure Cu suggests that the creep deformation of the composite is dominated by the deformation of the Cu matrix. The high stress exponent at low temperatures (200 °C and 300 °C) is thought be associated with the as-swaged microstructure, which contains elongated dislocation cells and subgrains that are stable and act as strong athermal obstacles at low temperatures. The mechanism of damage was found to be similar for all the creep tests performed, but the distribution and extent of damage were found to be very sensitive to the test temperature.

This article is from Metallurgical and Materials Transactions A 35 (2004): 695, doi:10.1007/s11661-004-0380-5. Posted with permission.

Copyright 2004 ASM International. This paper was published in Metallurgical and Materials Transactions A, Vol. 35, Issue 2, pp. 695-705 and is made available as an electronic reprint with the permission of ASM International. One print or electronic copy may be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via electronic or other means, duplications of any material in this paper for a fee or for commercial purposes, or modification of the content of this paper are prohibited.
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K. L. Lee, A. F. Whitehouse, S.I. Hong and Alan M. Russell. "Creep behavior of copper-chromium in-situ composite" Metallurgical and Materials Transactions A Vol. 35 Iss. 2 (2004) p. 695 - 705
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