Conference Proceedings

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Utilizing Quantum Dots to Enhance Solar Spectrum Conversion Efficiencies for Photovoltaics (with Hans Mayer, Matthew Lewis, and Dan M. Marrujo), Proceedings of the 2008 Materials Research Society Fall Meeting: Symposium M (2008)

Silicon-based photovoltaics typically convert less than 30% of the solar spectrum into usable electric power....

 

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Characterization of Thermally Evaporated Ag-Ge-S Thin Films (with Fei Wang, William Porter Dunn, Mukul Jain, Carter De Leo, Nicholas Vicker, Xiaomin Jin, Sergey Mamedov, and Punit Boolchand), Materials Research Society Symposium Proceedings (2008)

Thin films of ternary (GeS3)1-xAgx glasses (x=0.1 and 0.2) are studied in this work. Thin...

 

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Converting Traditional Materials Labs to Project-based Learning Experiences: Aiding Students' Development of Higher-order Cognitive Skills (with Linda Vanasupa, Katherine C. Chen, Jonathan Stolk, Trevor Harding, Blair London, and William Hughes), Forum on Materials Science and Engineering Education for 2020 (Materials Research Society Symposium Proceedings: Boston, MA, 2007) (2007)

Against a backdrop of compelling societal needs, graduates in science and engineering now must master...

 

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Designing and Manufacturing Microelectronic Packages for High-Power Light-Emitting Diodes (with Brian Wright and Jianbiao Pan), Proceedings of the 40th International Symposium on Microelectronics: San Jose, CA (2007)

A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was...

 

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Work-in-Progress - Self-Directed Learning and Motivation in a Project-based Learning Environment (with Trevor S. Harding, Linda Vanasupa, and Jonathan D. Stolk), Proceedings of the 37th Frontiers in Education Conference: Milwaukee, WI (2007)

Self-directed learning is a key competency in life-long learning, an outcome often cited for engineering...

 

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Collaborative Design of Project-Based Learning Courses: How to Implement a Mode of Learning That Effectively Builds Skills for the Global Engineer (with Jonathan Stolk and Linda Vanasupa), Proceedings of the American Society for Engineering Education Annual Conference: Honolulu, HI (2007)

Success for tomorrow’s engineers necessitates the design of curricula that promote awareness of the broader...

 

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A Systemic Model of Development: Strategically Enhancing Students' Cognitive, Psychomotor, Affective and Social Development (with Linda Vanasupa, Jonathan Stolk, and Trevor S. Harding), Proceedings of the 2007 ASEE International Conference on Research in Engineering Education (2007)

The challenges of the 21st century create an imperative for engineering educators: to design learning...

 

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A Design Methodology for Empowering Project-based Learning, American Society for Engineering Education Annual Conference (2007)

One of our primary objectives is to equip undergraduate engineering students to be successful global...

 

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Integrating Project-based Learning Throughout the Undergraduate Engineering Curriculum (with Katherine C. Chen and Linda Vanasupa), Journal of STEM Education: Innovation and Research (2007)

Equipping engineering students with the skills and knowledge required to be successful global engineers in...

 

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Curricula to Educate the 2020 MSE Engineering Professional: Simple But Powerful Changes in the Way that MSE is Taught (with Linda Vanasupa, Blair London, and Katherine C. Chen), ASEE 2006 Annual Conference Proceedings (2006)

National leaders in science and technology sectors speak in unison as they call for engineers...

 

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Infusing the Materials Engineering Curriculum with Sustainability Principles (with Katherine C. Chen, Linda Vanasupa, and Blair London), American Society for Engineering Education Annual Conference Proceedings (2006)

In order to better prepare our students for the complex, global world outside the confines...

 

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Nanotechnology, Biology, Ethics and Society: Overcoming the Multidisciplinary Teaching Challenges (with Linda Vanasupa, Matthew Ritter, Barbara Schader, Katherine C. Chen, Peter Schwartz, and Lynne Slivovsky), Proceedings of the 2006 Materials Research Society Spring Meeting: Symposium KK (2006)

One of the inherent challenges of teaching any emerging technology like nanotechnology, is the fact...

 

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Fabrication and Composition Control of NiTi Shape Memory Thin Films for Microactuators (with David J. Getchel), Proceedings of the 2005 Materials Research Society Spring Meeting: Symposium O (2005)

Microactuators fabricated with NiTi thin films take advantage of this material’s large energy density (~5-10...

 

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Teaching Corporate Culture: An Engineer's Survival Guide, Proceedings of the 2004 Materials Research Society Spring Meeting (2004)

The transition from new engineering graduate to successful member of corporate America is a difficult...

 

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Applications of Optical Emission Spectroscopy to Semiconductor Processing (with John G. Shabushnig and Paul R. Demko), Proceedings of the 1984 Materials Research Society Fall Meeting: Symposium F (1985)

Optical emission spectroscopy (OES) has proven to be a valuable tool in the developmrent and...

 

Articles

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The effects of thermal annealing on the obliquely deposited Ag–Ge–S thin films (with F. Wang, W. P. Dunn, M. Jain, C. De Leo, N. Vicker, Xiaomin Jin, S. Mamedov, and P. Boolchand), Journal of Physics and Chemistry of Solids (2009)

Obliquely deposited thin films of ternary Ag–Ge–S glasses are characterized in this work. Thin films...

 

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Application of Optical Emission Diagnostics and Control Related to Semiconductor Processing (with Greg C. Viloria), SPIE Plasma Processing (1992)

This paper discusses and shows applications of optical emission spectroscopy techniques and methods to monitor...

 

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In-Situ Film Thickness Measurements for Real-Time Monitoring and Control of Advanced Photoresist Track Coating Systems (with Thomas E. Metz and Horace O. Simmons), SPIE Microelectronic Processing Integration (1991)

This paper explores the methodologies of real-time measurement of photoresist film thickness on silicon wafers...

 

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Real-Time, In-Situ Measurement of Film Thickness and Uniformity During Plasma Ashing of Photoresist (with Horace Simmons, John T. Davies, and Thomas Metz), Advanced Techniques for Integrated Circuit Processing (1990)

This paper will discuss the performance of equipment which monitors and so controls photoresist thickness...

 

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Speciation of Cr (III) and Cr (VI) Via Reversed Phase HPLC With Inductively Coupled Plasma Emission Spectroscopic Detection (HPLC-ICP)24 (with I. S. Krull; D. Bushee; R. G. Schleicher; and S. B. Smith, Jr.), Analytical Letters (1982)

Chromium ions, viz., chromic (Cr+3 = III) and chromate (Cr+6 = VI), can be reliably,...

 

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Metal Cation/Anion Speciation Via Paired-Ion, Reversed Phase HPLC With Refractive Index and/or Inductively Coupled Plasma Emission Spectroscopic Detection Methods (with D. Bushee; I. S. Krull; and S. B. Smith, Jr.), Journal of Liquid Chromatography & Related Technologies (1982)

Conventional high performance liquid chromatography instrumentation and packing materials can be inexpensively and rapidly utilized...

 

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Development and Characterization of a 9-mm Inductively-Coupled Argon Plasma Source for Atomic Emission Spectrometry (with A. D. Weiss and G. M. Hieftje), Analytica Chimica Acta (1981)

A new 9-mm (i.d.) inductively-coupled plasma (ICP) torch is described which supports a stable, analytically...

 

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Characteristics of the Background Emission Spectrum From a Miniature Inductively-Coupled Plasma (with G. M. Hieftje), Analytica Chimica Acta (1980)

The spectral characteristics of the background radiation emitted by a miniature inductively-coupled plasma (i.c.p.) are...

 

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Enhancement of Pneumatic Nebulization Efficiency Through Application of an Electric Field (with G. M. Hieftje), Review of Scientific Instrumentation (1978)

A novel technique is described for reducing the size of aerosol droplets produced by a...

 

Patents

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Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon Wafers (with Emir Gurer and Ed C. Lee), United States Patent Number: 6,955,720 (2005)

An apparatus for delivering a fluidic media to a wafer includes a housing defining a...

 

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Semiconductor Wafer Processing System With Vertically-Stacked Process Chambers and Single-Axis Dual-Wafer Transfer System (with Frank S. Menagh, Helder R. Carvalheira, Philip A. Troiani, Dan L. Cossentine, Eric R. Vaughan, and Bruce E. Mayer), United States Patent Number: 6,610,150 (2003)

A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers...

 

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Method and Apparatus for Adaptive Process Control of Critical Dimensions During Spin Coating Process (with Emir Gurer), United States Patent Number: 6,177,133 (2001)

A spin coating process for controlling the mean thickness of photoresist on the surface of...

 

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Photoresist Coating Process Control With Solvent Vapor Sensor (with Herbert Litvak and Emir Gurer), United States Patent Number: 6,027,760 (2000)

An apparatus for spin coating surfaces with liquid polymer comprises a spin coating chamber having...

 

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Apparatus and Method for Automatically Identifying Chemical Species Within a Plasma Reactor Environment, United States Patent Number: 5, 014, 217 (1991)

A method and apparatus to control the plasma environment in a semiconductor or thin-film fabrication...

 

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In-Line Photoresist Thickness Monitor (with Tom W. Batchelder, Kenneth M. Sautter, and Gary H. Memovich), United States Patent Number: 4,977,330 (1990)

An in-line photoresist thickness measuring device wherein a plurality of projection optical fibers are disposed...

 

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Optical Switch, United States Patent Number: 4,938,555 (1990)

An optical switch for transmitting light between a first location and a selected one of...