Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon Wafers
Article comments
11 pages. Also available from the United States Patent and Trademark Office. Website: http://www.uspto.gov.
NOTE: At the time of publication, the author Richard Savage was not yet affiliated with Cal Poly.
Abstract
An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.
Suggested Citation
Emir Gurer, Ed C. Lee, and Richard Savage. "Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon Wafers" 2005
Available at: http://works.bepress.com/rsavage/11