Articles
The effects of thermal annealing on the obliquely deposited Ag–Ge–S thin films (with F. Wang, W. P. Dunn, M. Jain, C. De Leo, N. Vicker, Xiaomin Jin, S. Mamedov, and P. Boolchand), Journal of Physics and Chemistry of Solids (2009)
Obliquely deposited thin films of ternary Ag–Ge–S glasses are characterized in this work. Thin films...
Application of Optical Emission Diagnostics and Control Related to Semiconductor Processing (with Greg C. Viloria), SPIE Plasma Processing (1992)
This paper discusses and shows applications of optical emission spectroscopy techniques and methods to monitor...
In-Situ Film Thickness Measurements for Real-Time Monitoring and Control of Advanced Photoresist Track Coating Systems (with Thomas E. Metz and Horace O. Simmons), SPIE Microelectronic Processing Integration (1991)
This paper explores the methodologies of real-time measurement of photoresist film thickness on silicon wafers...
Real-Time, In-Situ Measurement of Film Thickness and Uniformity During Plasma Ashing of Photoresist (with Horace Simmons, John T. Davies, and Thomas Metz), Advanced Techniques for Integrated Circuit Processing (1990)
This paper will discuss the performance of equipment which monitors and so controls photoresist thickness...
Speciation of Cr (III) and Cr (VI) Via Reversed Phase HPLC With Inductively Coupled Plasma Emission Spectroscopic Detection (HPLC-ICP)24 (with I. S. Krull; D. Bushee; R. G. Schleicher; and S. B. Smith, Jr.), Analytical Letters (1982)
Chromium ions, viz., chromic (Cr+3 = III) and chromate (Cr+6 = VI), can be reliably,...
Conference Proceedings
Utilizing Quantum Dots to Enhance Solar Spectrum Conversion Efficiencies for Photovoltaics (with Hans Mayer, Matthew Lewis, and Dan M. Marrujo), Proceedings of the 2008 Materials Research Society Fall Meeting: Symposium M (2008)
Silicon-based photovoltaics typically convert less than 30% of the solar spectrum into usable electric power....
Characterization of Thermally Evaporated Ag-Ge-S Thin Films (with Fei Wang, William Porter Dunn, Mukul Jain, Carter De Leo, Nicholas Vicker, Xiaomin Jin, Sergey Mamedov, and Punit Boolchand), Materials Research Society Symposium Proceedings (2008)
Thin films of ternary (GeS3)1-xAgx glasses (x=0.1 and 0.2) are studied in this work. Thin...
Converting Traditional Materials Labs to Project-based Learning Experiences: Aiding Students' Development of Higher-order Cognitive Skills (with Linda Vanasupa, Katherine C. Chen, Jonathan Stolk, Trevor Harding, Blair London, and William Hughes), Forum on Materials Science and Engineering Education for 2020 (Materials Research Society Symposium Proceedings: Boston, MA, 2007) (2007)
Against a backdrop of compelling societal needs, graduates in science and engineering now must master...
Designing and Manufacturing Microelectronic Packages for High-Power Light-Emitting Diodes (with Brian Wright and Jianbiao Pan), Proceedings of the 40th International Symposium on Microelectronics: San Jose, CA (2007)
A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was...
Work-in-Progress - Self-Directed Learning and Motivation in a Project-based Learning Environment (with Trevor S. Harding, Linda Vanasupa, and Jonathan D. Stolk), Proceedings of the 37th Frontiers in Education Conference: Milwaukee, WI (2007)
Self-directed learning is a key competency in life-long learning, an outcome often cited for engineering...
Patents
Plasma Deposition of Spin Chucks to Reduce Contamination of Silicon Wafers (with Emir Gurer and Ed C. Lee), United States Patent Number: 6,955,720 (2005)
An apparatus for delivering a fluidic media to a wafer includes a housing defining a...
Semiconductor Wafer Processing System With Vertically-Stacked Process Chambers and Single-Axis Dual-Wafer Transfer System (with Frank S. Menagh, Helder R. Carvalheira, Philip A. Troiani, Dan L. Cossentine, Eric R. Vaughan, and Bruce E. Mayer), United States Patent Number: 6,610,150 (2003)
A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers...
Method and Apparatus for Adaptive Process Control of Critical Dimensions During Spin Coating Process (with Emir Gurer), United States Patent Number: 6,177,133 (2001)
A spin coating process for controlling the mean thickness of photoresist on the surface of...
Photoresist Coating Process Control With Solvent Vapor Sensor (with Herbert Litvak and Emir Gurer), United States Patent Number: 6,027,760 (2000)
An apparatus for spin coating surfaces with liquid polymer comprises a spin coating chamber having...
Apparatus and Method for Automatically Identifying Chemical Species Within a Plasma Reactor Environment, United States Patent Number: 5, 014, 217 (1991)
A method and apparatus to control the plasma environment in a semiconductor or thin-film fabrication...