Article
Comparison of Thermal Properties of Laser Deposition and Traditional Welding Process Via Thermal Diffusivity Measurement
Proceedings of the 17th Annual Solid Freeform Fabrication Symposium (2006, Austin, TX)
Abstract
Laser deposition is an effective process for mold and die repair. In order to improve the part repair quality, the process impact on thermal diffusivity and thermal conductivity needs to be understood for laser deposited, welded and virgin H13. In this paper, H13 tool steel samples were made by laser deposition, welding and virgin H13 and then cut into pieces. Experiments were conducted to investigate the thermal diffusivity and conductivity. A laser flash method is used to test these samples. The future work and opportunities are also summarized.
Meeting Name
17th Annual Solid Freeform Fabrication Symposium, SFF 2006 (2006: Aug. 14-16, Austin, TX)
Department(s)
Mechanical and Aerospace Engineering
Second Department
Materials Science and Engineering
Research Center/Lab(s)
Intelligent Systems Center
Keywords and Phrases
- Repair,
- Thermal Conductivity,
- Tool Steel,
- Welding,
- Diffusivity Measurements,
- H13,
- H13 Tool Steel,
- Laser Depositions,
- Laser Flash,
- Laser Flash Methods,
- Process Impact,
- Welding Process,
- Deposition,
- H13,
- Laser Deposition,
- Laser Flash,
- Tool Steel
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Publication Date
8-16-2006
Publication Date
16 Aug 2006
Disciplines
Citation Information
Yu Yang, Omoghene Osaze Obahor, Yaxin Bao, Todd E. Sparks, et al.. "Comparison of Thermal Properties of Laser Deposition and Traditional Welding Process Via Thermal Diffusivity Measurement" Proceedings of the 17th Annual Solid Freeform Fabrication Symposium (2006, Austin, TX) (2006) p. 446 - 452 Available at: http://works.bepress.com/robert-landers/29/
This research was supported by the National Science Foundation Grant Number DMI-9871185, the grant from the U.S. Air Force Research Laboratory contract # FA8650-04-C-5704, and UMR Intelligent Systems Center. Their support is greatly appreciated.