Articles

PDF

Effect of Gold Content on the Reliability of SnAgCu Solder Joints (with J. Silk, M. Powers, and P. Hyland), IEEE Transactions on Componenets, Packaging, and Manufacturing Technology (2011)

Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well...

 

PDF

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging (with Mike Powers, Julie Silk, and Patrick Hyland), Journal of Electronic Materials (2011)

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish,...

 

PDF

Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages (with Andrew Farris, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger), Microelectronics Reliability (2009)

This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip...

 

PDF

Optimization of Engineering Tolerance Design Using Revised Loss Functions (with Jeh-Nan Pan), Engineering Optimization (2009)

Engineering tolerance design plays an important role in modern manufacturing. Both symmetric and asymmetric tolerances...

 

PDF

Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints (with Tzu-Chien Chou, Jasbir Bath, Dennis Willie, and Brian J. Toleno), Soldering & Surface Mount Technology (2009)

Purpose – The purpose of this paper is to investigate the effects of reflow time,...

 

PDF

Finding and Optimising the Key Factors for the Multiple-Response Manufacturing Process (with Jeh-Nan Pan and Chun-Yi Lee), International Journal of Production Research (2009)

With the advent of modern technology, manufacturing processes became so sophisticated that a single quality...

 

PDF

The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability (with Minh-Nhat Le and Cuong Van Pham), Journal of Microelectronics and Electronic Packaging (2009)

This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on...

 

PDF

Investigation of the Lead-free Solder Joint Shear Performance (with James Webster and Brian J. Toleno), Journal of Microelectronics and Electronics Packaging (2007)

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure...

 

PDF

Effect of Chromium–Gold and Titanium–Titanium Nitride–Platinum–Gold Metallization on Wire/Ribbon Bondability (with Robert M. Pafchek, Frank F. Judd, and Jason B. Baxter), IEEE Transactions on Advanced Packaging (2006)

Gold metallization on wafer substrates for wire/ribbon bond applications requires good bond strength to the...

 

PDF

The Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Strength (with Brian J. Toleno, Tzu-Chien Chou, and Wesley J. Dee), Soldering & Surface Mount Technology (2006)

Purpose – The purpose of this work is to study the effect of the reflow...

 

PDF

Lead-free Solder Joint Reliability – State of the Art and Perspectives (with Jyhwen Wang and David M. Shaddock), Journal of Microelectronics and Electronics Packaging (2005)

There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the...

 

PDF

Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP (with Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, and David J. Leandri), IEEE Transactions on Electronics Packaging Manufacturing (2004)

Stencil printing continues to be the dominant method of solder deposition in high-volume surface-mount assembly....

 

PDF

Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates (with Gregory L. Tonkay and Alejandro Quintero), Journal of Electronics Manufacturing (1999)

Screen printing has been the dominant method of thick film deposition because of its low...

 

Contributions to Books

PDF

Backward and Forward Compatibility (with Jasbir Bath, Xiang Zhou, and Dennis Willie), Lead-Free Soldering (2007)

In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’...

 

Conference Proceedings

PDF

A Study of Solder Joint Failure Criteria (with Julie Silk), Proceedings of the 44th International Symposium on Microelectronics: Long Beach, CA (2011)

One of the challenges in an experimental study of solder joint reliability is to determine...

 

PDF

Effect of Gold Content on the Reliability of SnAgCu Solder Joints (with Julie Silk, Mike Powers, and Patrick Hyland), Proceedings of IPC Printed Circuits Expo, APEX and the Designers Summit 2011: Las Vegas, NV (2011)

Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for...

 

PDF

Assessing Curriculum Improvement Through Senior Projects (with Albert Liddicoat, James G. Harris, and Linda Shepherd), Proceedings of the 2010 ASEE Annual Conference & Exposition (2010)

Senior project and/or capstone design courses are intended to provide a culminating design experience for...

 

PDF

Development and Assessment of a PCB Layout and Manufacturong Laboratory Module in Introductory Electric Circuits for EE and Non-EE Majors (with Albert Liddicoat, James G. Harris, Gary Perks, and Linda Shepherd), Proceedings of the 2010 ASEE Annual Conference & Exposition (2010)

In standard introductory electric circuits laboratories for electrical engineering (EE) majors and non-EE majors, prototype...

 

PDF

Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies (with Nicholas Vickers, Kyle Rauen, and Andrew Farris), Proceedings of the 41st International Symposium on Microelectronics: Providence, RI (2008)

This paper presents the failure analysis results of board level drop tests. In this study,...

 

PDF

Drop Impact Dynamic Response Study of JEDEC JESD22-B111 Test Board (with Michael Krist, Andrew Farris, and Nicolas Vickers), Proceedings of the 41st International Symposium on Microelectronics: Providence, RI (2008)

Mobile and handheld electronic devices are prone to being dropped. This drop event may result...

 

PDF

The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability (with Minh-Nhat Le and Cuong Van Pham), Proceedings of the 41st International Symposium on Microelectronics: Providence, RI (2008)

This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the...

 

PDF

Work in Progress - Enhancing Student-Learning Through State-of-The-Art Systems Level Design and Implementation (with Albert A. Liddicoat, James G. Harris, Dominic J. Dal Bello, and Lynne A. Slivovsky), Proceedings of the 38th ASEE / IEEE Frontiers in Education Conference: Saratoga Springs, NY (2008)

The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught...

 

PDF

A Project-Based Electronics Manufacturing Laboratory Course for Lower-Division Engineering Students (with Albert Liddicoat, James G. Harris, and Dominic Dal Bello), Proceedings of the 2008 ASEE Annual Conference & Exposition: Pittsburg, PA (2008)

This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of...

 

PDF

Curricular Enhancement to Support Project-Based Learning in Computer and Electrical Engineering (with Albert Liddicoat, James G. Harris, and Lynne A. Slivovsky), Proceedings of the 2008 ASEE Annual Conference & Exposition: Pittsburg, PA (2008)

Undergraduate computer and electrical engineering programs often partition the curriculum into several courses based on...

 

PDF

Enhancing Student Learning Through State-of-the-Art Systems Level Design and Implementation: The development of a lower division learning module (with James G. Harris, Dominic Dal Bello, and Albert Liddicoat), Proceedings of the 2008 ASEE Annual Conference & Exposition: Pittsburg, PA (2008)

The Cal Poly/Allan Hancock team is developing a learning module that will allow all lower...

 

PDF

Drop Test Reliability of Lead-free Chip Scale Packages (with Andrew Farris, Albert Liddicoat, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger), Proceedings of the 58th IEEE Electronics Components and Technology Conference: Lake Buena Vista, FL (2008)

This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages...

 

PDF

Designing and Manufacturing Microelectronic Packages for High-Power Light-Emitting Diodes (with Brian Wright and Richard Savage), Proceedings of the 40th International Symposium on Microelectronics: San Jose, CA (2007)

A new microelectronic package was designed for a high-power light-emitting diode (LED). The objective was...

 

PDF

Investigation of the Lead-free Solder Joint Shear Performance (with James Webster and Brian J. Toleno), Proceedings of the 39th International Symposium on Microelectronics: San Diego, CA (2006)

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure...

 

PDF

Estimation of Liquidus Temperature when SnAgCu BGA/CSP Components are Soldered with SnPb Paste, 7th International Conference on Electronics Packaging Technology: Shanghai (2006)

Recently, the soldering of lead-free components with SnPb paste, or lead-free backward compatibility, is becoming...

 

PDF

A Comparative Study of Various Loss Functions in the Economic Tolerance Design (with JehNan Pan), 2006 IEEE International Conference on Management of Innovation and Technology: Singapore (2006)

Engineering tolerance design plays an important role in modern manufacturing. In this paper, the Kapur's...

 

PDF

The Effectiveness Analysis of the Online Tools for Engineering Faculty Needs (with Ismail Fidan and Leijun Li), Proceedings of the 2005 ASEE Annual Conference & Exposition: Portland, OR (2005)

As the use of Internet is increasing dramatically, many faculty members are using it in...

 

PDF

Lead-free Solder Joint Reliability – State of the Art and Perspectives (with Jyhwen Wang and David M. Shaddock), Proceedings of the 37th International Symposium on Microelectronics: Long Beach, CA (2004)

There is an increasing demand in replacing tin-lead (Sn/Pb) solders with lead-free solders in the...

 

PDF

Wire Bonding Challenges in Optoelectronics Packaging (with Patrice Fraud), Proceedings of the 1st SME Annual Manufacturing Technology Summit: Dearborn, MI (2004)

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there...

 

PDF

Effect of Chromium-Gold and Titanium-Titanium Nitride-Platinum-Gold Metallization on Wire/Ribbon Bondability (with Robert M. Pafchek, Frank F. Judd, and Jason Baxter), Proceedings of the 29th IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (2004)

Gold metallization on wafer substrates for wire/ribbon bond applications require good bond strength to the...

 

PDF

Gauge Repeatability & Reproducibility Study for a 3-D Solder Paste Inspection System (with Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, and David J. Leandri), Proceedings of the 1999 International Symposium of Microlectronics (IMAPS'99): Chicago, IL (1999)

Due to the increased use of Ball Grid Arrays (BGAs) and fine pitch and ultra...

 

PDF

Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP (with Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, and David J. Leandri), Proceedings of the 24th IEEE/CPMT Electronics Manufacturing Technology Symposium (1999)

Stencil printing continues to be the dominant method of solder deposition in high volume surface...

 

PDF

Screen Printing Process Design of Experiments for Fine Line Printing of Thick Film Ceramic Substrates (with Gregory L. Tonkay and Alejandro Quintero), 1998 Proceedings of the International Symposium on Microelectronics: San Diego, CA (1998)

Screen printing has been the dominant method of thick film deposition because of its low...