Contributions to Books

Backward and Forward Compatibility

Jianbiao Pan, California Polytechnic State University - San Luis Obispo
Jasbir Bath, Solectron Corporation
Xiang Zhou, Solectron Corporation
Dennis Willie, Solectron Corporation

Article comments

Copyright © 2007 Springer. The definitive version is available at http://dx.doi.org/10.1007/978-0-387-68422-2_7.

Abstract

In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’ impending lead-free directives, the electronics industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and involves movement of the whole electronics industry supply chain. In reality, there is a transition period.

Suggested Citation

Jianbiao Pan, Jasbir Bath, Xiang Zhou, and Dennis Willie. "Backward and Forward Compatibility" Lead-Free Soldering. , 2007. 173-197.
Available at: http://works.bepress.com/pan/31