Articles
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish (with Julie Silk and Mike Powers), IPC APEX Expo 2012: San Diego, CA (2012)
In this paper, we report on a comprehensive study regarding the morphology evolution and voiding...
Effect of Gold Content on the Reliability of SnAgCu Solder Joints (with J. Silk, M. Powers, and P. Hyland), IEEE Transactions on Componenets, Packaging, and Manufacturing Technology (2011)
Electroplated Ni/Au over Cu is a popular metallization for printed circuit board finish as well...
Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging (with Mike Powers, Julie Silk, and Patrick Hyland), Journal of Electronic Materials (2011)
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish,...
Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages (with Andrew Farris, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger), Microelectronics Reliability (2009)
This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip...
Optimization of Engineering Tolerance Design Using Revised Loss Functions (with Jeh-Nan Pan), Engineering Optimization (2009)
Engineering tolerance design plays an important role in modern manufacturing. Both symmetric and asymmetric tolerances...
Contributions to Books
Backward and Forward Compatibility (with Jasbir Bath, Xiang Zhou, and Dennis Willie), Lead-Free Soldering (2007)
In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’...
Conference Proceedings
A Study of Solder Joint Failure Criteria (with Julie Silk), Proceedings of the 44th International Symposium on Microelectronics: Long Beach, CA (2011)
One of the challenges in an experimental study of solder joint reliability is to determine...
Effect of Gold Content on the Reliability of SnAgCu Solder Joints (with Julie Silk, Mike Powers, and Patrick Hyland), Proceedings of IPC Printed Circuits Expo, APEX and the Designers Summit 2011: Las Vegas, NV (2011)
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for...
Assessing Curriculum Improvement Through Senior Projects (with Albert Liddicoat, James G. Harris, and Linda Shepherd), Proceedings of the 2010 ASEE Annual Conference & Exposition (2010)
Senior project and/or capstone design courses are intended to provide a culminating design experience for...
Development and Assessment of a PCB Layout and Manufacturong Laboratory Module in Introductory Electric Circuits for EE and Non-EE Majors (with Albert Liddicoat, James G. Harris, Gary Perks, and Linda Shepherd), Proceedings of the 2010 ASEE Annual Conference & Exposition (2010)
In standard introductory electric circuits laboratories for electrical engineering (EE) majors and non-EE majors, prototype...
Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies (with Nicholas Vickers, Kyle Rauen, and Andrew Farris), Proceedings of the 41st International Symposium on Microelectronics: Providence, RI (2008)
This paper presents the failure analysis results of board level drop tests. In this study,...