Articles
Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages (with Andrew Farris, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, and David A. Geiger), Microelectronics Reliability (2009)
This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free chip...
Optimization of Engineering Tolerance Design Using Revised Loss Functions (with Jeh-Nan Pan), Engineering Optimization (2009)
Engineering tolerance design plays an important role in modern manufacturing. Both symmetric and asymmetric tolerances...
Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints (with Tzu-Chien Chou, Jasbir Bath, Dennis Willie, and Brian J. Toleno), Soldering & Surface Mount Technology (2009)
Purpose – The purpose of this paper is to investigate the effects of reflow time,...
Finding and Optimising the Key Factors for the Multiple-Response Manufacturing Process (with Jeh-Nan Pan and Chun-Yi Lee), International Journal of Production Research (2009)
With the advent of modern technology, manufacturing processes became so sophisticated that a single quality...
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability (with Minh-Nhat Le and Cuong Van Pham), Journal of Microelectronics and Electronic Packaging (2009)
This paper presents a systematic study on the effect of 120 KHz ultrasonic frequency on...
Contributions to Books
Backward and Forward Compatibility (with Jasbir Bath, Xiang Zhou, and Dennis Willie), Lead-Free Soldering (2007)
In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’...
Conference Proceedings
Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies (with Nicholas Vickers, Kyle Rauen, and Andrew Farris), Proceedings of the 41st International Symposium on Microelectronics: Providence, RI (2008)
This paper presents the failure analysis results of board level drop tests. In this study,...
Drop Impact Dynamic Response Study of JEDEC JESD22-B111 Test Board (with Michael Krist, Andrew Farris, and Nicolas Vickers), Proceedings of the 41st International Symposium on Microelectronics: Providence, RI (2008)
Mobile and handheld electronic devices are prone to being dropped. This drop event may result...
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability (with Minh-Nhat Le and Cuong Van Pham), Proceedings of the 41st International Symposium on Microelectronics: Providence, RI (2008)
This paper presents a systematic study on the effect of 120KHz ultrasonic frequency on the...
Work in Progress - Enhancing Student-Learning Through State-of-The-Art Systems Level Design and Implementation (with Albert A. Liddicoat, James G. Harris, Dominic J. Dal Bello, and Lynne A. Slivovsky), Proceedings of the 38th ASEE / IEEE Frontiers in Education Conference: Saratoga Springs, NY (2008)
The curriculum for undergraduate engineering programs is often partitioned into several courses that are taught...
A Project-Based Electronics Manufacturing Laboratory Course for Lower-Division Engineering Students (with Albert Liddicoat, James G. Harris, and Dominic Dal Bello), Proceedings of the 2008 ASEE Annual Conference & Exposition: Pittsburg, PA (2008)
This paper presents a project-based laboratory course on electronics design and manufacturing. The goal of...