Articles

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Correlation-Space Description of the Percolation Transition in Composite Microstructures (with Christopher A. Schuh), Materials Science Faculty Publications and Presentations (2007)
We explore the percolation threshold shift as short-range correlations are introduced and systematically varied in...
 

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Simulation of Plasticity in Nanocrystalline Silicon (with M. J. Demkowicz, A. S. Argon, and D. Farkas), Materials Science Faculty Publications and Presentations (2007)
Molecular dynamics investigation of plasticity in a model nanocrystalline silicon system demonstrates that inelastic deformation...
 

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Determination of Three-Dimensional Grain Boundary Connectivity from Two-Dimensional Microstructures, Materials Science Faculty Publications and Presentations (2007)
The connectivity of so-called “special” and “general” grain boundaries at a quadruple node is known...
 

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Correlations Beyond the Nearest-Neighbor Level in Grain Boundary Networks (with C. A. Schuh), Materials Science Faculty Publications and Presentations (2006)
Correlations among ‘special’ and ‘general’ grain boundaries are studied on two-dimensional networks, by examining the...
 

Presentations

Effects of Surface Orientation on High-Temperature Oxidation Behavior (with Louis Bonfrisco), 2008 TMS Annual Meeting (2008)
Surface orientation plays an important role in oxidation behavior; studies of single crystals suggest that...
 

Microstructural Modification of Thick Copper Films to Optimize Chemical-Mechanical Planarization of Through-Wafer Interconnects (with Patrick Andersen and Mariela Bentancur), 2008 TMS Annual Meeting (2008)
Large through-wafer interconnects may be required for high current applications or novel devices like backside...
 

Microstructural Stability in Grain Boundary Engineered Materials (with Scott Schlegel), 2008 TMS Annual Meeting (2008)
Grain boundary engineering (GBE) is a thermomechanical process in which sequential straining and annealing cycles...
 

Influence of Copper Microstructure on Aggressive Chemical Mechanical Planarization Processes (with Patrick Andersen), MRS Spring Meeting 2007 (2007)
Novel die-stacking schema using through-wafer vias may require thick electroplated copper and aggressive first-step CMP....
 

Characterization of Developing Bovine Cartilage Using Immuno-SEM (with Michelle Gerritsen, Janet Hampikian, Julia Oxford, and Jonathan Henderson), Materials Science & Technology 2006 Conference and Exhibition (2006)
Collagen is an important material in tissues of living organisms. Found almost everywhere in the...
 

Percolation Theory for Two-Phase Materials with Nonrandom Topologies, TMS Annual Meeting (2006)
Percolation theory is commonly used to develop microstructure-property relationships for two-phase materials. Although many composite...
 

Length Scale of Correlations in Grain Boundary Networks, Materials Research Society (2005)
Statistical descriptions of grain boundary networks tend to focus upon the connectivity among “special” grain...
 

Other

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Knowledge Surveys, CTL Teaching Gallery (2009)
"A knowledge survey consists of course learning objectives framed as questions and is given before...
 

Thermal Stability of Cu-Sn Metal-Metal Interconnects (with Jemima Fernandez and Amy Moll) (2008)
Megan Frary1; Amy Moll1; 1Boise State University Cu-Sn is currently being investigated as an alternative...