Conference Proceedings
Work in Progress - A Design Guide to Retain Female (and Male) Students in Engineering (with Linda Vanasupa, Stacey Breitenbach, and Karen R. Bangs), Proceedings of the 38th American Society for Engineering Education (ASEE)/Institute of Electrical and Electronics Engineers (IEEE) Frontiers in Education Conference (2008)
Despite a rich body of research on factors contributing to attrition of women during the...
Converting Traditional Materials Labs to Project-based Learning Experiences: Aiding Students' Development of Higher-order Cognitive Skills (with Linda Vanasupa, Jonathan Stolk, Richard N. Savage, Trevor Harding, Blair London, and William Hughes), Forum on Materials Science and Engineering Education for 2020 (Materials Research Society Symposium Proceedings: Boston, MA, 2007) (2007)
Against a backdrop of compelling societal needs, graduates in science and engineering now must master...
Exciting Students About Materials Science and Engineering: A Project-Based, Service-Learning Museum Design Course, Proceedings of the ASEE Annual Conference (2007)
A new course was developed for Materials Engineering students to design, create, and install interactive,...
Integrating Project-based Learning Throughout the Undergraduate Engineering Curriculum (with Richard N. Savage and Linda Vanasupa), Journal of STEM Education: Innovation and Research (2007)
Equipping engineering students with the skills and knowledge required to be successful global engineers in...
Work in Progress: Crossing the Engineering Border into Art and Society with a Materials Selection for the Life Cycle Course (with Blair London), Proceedings of teh 36th ASEE/IEEE Frontiers in Education Conference (2006)
A new course in materials engineering has been developed to incorporate industrial design and sustainability...
Articles
Global Challenges as Inspiration: A Classroom Strategy to Foster Social Responsibility (with Linda Vanasupa and Lynn Slivovsky), Science and Engineering Ethics (2006)
Social responsibility is at the heart of the Engineer’s Creed embodied in the pledge that...
Effects of Intermetallic Morphology at the Metallic Particle/Solder Interface on Mechanical Properties of Sn-Ag-Based Solder Joints (with H. Rhee, F. Guo, J. G. Lee, and K. N. Subramanian), Journal of Electronic Materials (2003)
Mechanical incorporation of metallic particles in the Sn-Ag-based solder resulted in various intermetallic compound (IMC)...
Formation and Growth of Intermetallics around Metallic Particles in Eutectic Sn-Ag Solder (with J. G. Lee and K. N. Subrmanian), Journal of Electronic Materials (2003)
Incorporation of metallic particulate reinforcements in eutectic Sn-Ag solder results in the formation of intermetallic...
Physical Metallurgy: Providing Unifying Principles in Diverse Areas of Materials Engineering (with Vilupanur A. Ravi), JOM (2003)
Damage Accumulation Under Repeated Reverse Stressing of Sn-Ag Solder Joints (with A. Telang, J. G. Lee, and K. N. Subramanian), Journal of Electronic Materials (2002)
To better understand the effect of repeated reverse stress in solder joints, a new testing...