Particles
Experimental and analytical study of submicrometer particle removal from deep trenches (with Kaveh Bakhtari, Rasim O. Guldiken, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2006)
Particle removal from patterned wafers and trenches presents a tremendous challenge in semiconductor manufacturing. In...
Chemical mechanical planarization
Analysis of scratches formed on oxide surface during chemical mechanical planarization (with Jae-Gon Choi, Y. Nagendra Prasad, In-Kwon Kim, In-Gon Kim, Woo-Jin Kim, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2009)
Scratch formation on patterned oxide wafers during the chemical mechanical planarization process was investigated. Silica...
Integrated circuits - Wafer-scale integration
Effect of different deposition mediums on the adhesion and removal of particles (with S. Hu, Tae-Hoon Kim, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2010)
The purpose of this study is to investigate the effect of the different deposition mediums...
Analysis of scratches formed on oxide surface during chemical mechanical planarization (with Jae-Gon Choi, Y. Nagendra Prasad, In-Kwon Kim, In-Gon Kim, Woo-Jin Kim, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2009)
Scratch formation on patterned oxide wafers during the chemical mechanical planarization process was investigated. Silica...
Semiconductors
Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time (with Kaveh Bakhtari, Rasim O. Guldiken, Prashanth Makaram, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2006)
The removal of nanoparticles is becoming increasingly challenging as the minimum linewidth continues to decrease...
Experimental and analytical study of submicrometer particle removal from deep trenches (with Kaveh Bakhtari, Rasim O. Guldiken, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2006)
Particle removal from patterned wafers and trenches presents a tremendous challenge in semiconductor manufacturing. In...
Acoustic streaming
Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time (with Kaveh Bakhtari, Rasim O. Guldiken, Prashanth Makaram, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2006)
The removal of nanoparticles is becoming increasingly challenging as the minimum linewidth continues to decrease...
Slurry
The effect of frictional and adhesion forces attributed to slurry particles on the surface quality of polished copper (with Yi-Koan Hong, Ja-Hyung Han, Tae-Gon Kim, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2007)
The effect of frictional and adhesion forces attributed to slurry particles on the quality of...
Semiconductor wafers
Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning (with Sang-Ho Lee, Ju-Suk Ryu, Yi-Koan Hong, Tae-Gon Kim, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2006)
In this study, the interfacial and electrokinetic phenomena of mixtures of isopropyl alcohol (IPA) and...
Nanoparticles
Effect of different deposition mediums on the adhesion and removal of particles (with S. Hu, Tae-Hoon Kim, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2010)
The purpose of this study is to investigate the effect of the different deposition mediums...
Experimental and numerical investigation of nanoparticle removal using acoustic streaming and the effect of time (with Kaveh Bakhtari, Rasim O. Guldiken, Prashanth Makaram, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2006)
The removal of nanoparticles is becoming increasingly challenging as the minimum linewidth continues to decrease...
Copper - Surfaces
The effect of frictional and adhesion forces attributed to slurry particles on the surface quality of polished copper (with Yi-Koan Hong, Ja-Hyung Han, Tae-Gon Kim, and Ahmed A. Busnaina), Center for High-Rate Nanomanufacturing Publications (2007)
The effect of frictional and adhesion forces attributed to slurry particles on the quality of...