Jay Singh
California Polytechnic State University, San Luis Obispo
Expertise
- Package design
- Distribution environment measurement and simulation (packaging forensics)
- Material and package testing
- Product-package compatibility
- Life Cycle Assessment
- Radio Frequency Identification (RFID)
Honors & Awards
- Editor-in-Chief, Journal of Applied Packaging Research (January 2009 - present)
- Most Promising Scientific Work, 23rd International Association of Packaging Research Institutes’ (IAPRI) Symposium, Windsor, UK, June 2007
- Outstanding Industrial Technology Professor Award - Region 6, National Association of Industrial Technology (NAIT), 2006
- Division 1 Vice Chair & Co-Chair of the RFID Task Group, committee D10.18 of ASTM (2007 – present)
- Best Presentation by a Young Scientist, 22nd IAPRI World Symposium on Packaging, Campinas, Brazil, June 2005
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