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A CN-FDTD Scheme and Its Application to VLSI Interconnects/Substrate Modeling
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2004, Santa Clara, CA)
  • Rui Qiang
  • Dagang Wu
  • Ji Chen
  • Chen Wang
  • James L. Drewniak, Missouri University of Science and Technology
Abstract

In this paper, a two-dimensional (2D) Crank-Nicholason (CN) finite difference time domain (FDTD) method is proposed for VLSI interconnect/substrate characterization. Through rigorous truncation and dispersion error analyses, a guideline on using this technique is presented. Several iterative solvers are investigated to accelerate the solution of the CN-FDTD scheme. Numerical examples are given to demonstrate the accuracy and the efficiency of the proposed algorithm.

Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2004: Aug. 9-13, Santa Clara, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
  • 2D FDTD Method,
  • CN-FDTD Scheme,
  • Crank-Nicholason Method,
  • VLSI,
  • VLSI Interconnect/Substrate Characterization,
  • Dispersion Error Analysis,
  • Finite Difference Time Domain Method,
  • Finite Difference Time-Domain Analysis,
  • Integrated Circuit Interconnections,
  • Integrated Circuit Modelling,
  • Iterative Methods,
  • Iterative Solvers,
  • Truncation Error Analysis,
  • Two-Dimensional FDTD Method,
  • Very Large Scale Integration,
  • Finite Difference Methods,
  • Time Domain Analysis,
  • Finite Wordlength Effects,
  • Error Analysis,
  • Magnetic Analysis,
  • Iterative Algorithms,
  • Equations
International Standard Book Number (ISBN)
780384431
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
8-1-2004
Publication Date
01 Aug 2004
Citation Information
Rui Qiang, Dagang Wu, Ji Chen, Chen Wang, et al.. "A CN-FDTD Scheme and Its Application to VLSI Interconnects/Substrate Modeling" Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2004, Santa Clara, CA) Vol. 1 (2004) p. 97 - 101 ISSN: 1077-4076
Available at: http://works.bepress.com/james_wu_lvhn/42/