In one embodiment, a system for manipulation of a micro component includes a gripper subsystem for lifting, holding, and releasing a micro component. The gripper subsystem includes a base substrate having a work side and an opposing side, a positive electrode secured to the work side of the base substrate, a negative electrode suitably spaced from the positive electrode andsecured to the work side of the base substrate, a dielectric layer formed over the work side of the base substrate and the positive and negative electrodes,and a hydrophobic layer comprising a hydrophobic material with predictable electrowetting behavior formed over the dielectric layer such that the dielectric layer is between the work side of the base substrate and the hydrophobic layer. A method for manipulation of a micro component is also provided as well as amethod of manufacturing the system for manipulation of a micro component.