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On-Chip 3D Inductors Using Thru-Wafer Vias (with Gary VanAckern, R. Jacob Baker, and Vishal Saxena), IEEE Workshop on Microelectronics and Electron Devices (WMED) (2012)
Three-dimensional (3D) inductors using high aspect ratio (10:1); thru-wafer via (TWV) technology in a complementary...
i-STEM Summer Institute: An Integrated Approach to Teacher Professional Development in STEM (with Louis S. Nadelson, Anne Seifert, and Brad Coats), Journal of STEM Education: Innovation and Outreach (2012)
The importance of STEM education to societal developments provides justification for assuring K–12 teachers are...
Living in a Materials World: Materials Science and Engineering Professional Development for K-12 Educators (with Louis S. Nadelson and Anne Louise Seifert), 118th ASEE Annual Conference and Exposition (2011)
Advances in materials science are fundamental to technological developments and have broad societal impacts. For...
Improving Engineering Students’ Cognitive and Affective Preparedness with a Pre-Instructional E-Learning Strategy (with Seung Youn Chyung, Brian Marx, Megan Frary, and Janet Callahan), Advances in Engineering Education (2010)
During the 2006–2007 academic year, five faculty members from the College of Engineering at Boise...
Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration (with J. M. Lannon Jr., C. Gregory, M. Lueck, A. Huffman, D. Temple, and William B. Knowlton), Proceedings of the SPIE (2010)
The demand for more complex and multifunctional micro systems with enhanced performance characteristics for military...
The Role of Intrinsic Goal Orientation, Self-Efficacy, and E-Learning Practice in Engineering Education (with Seung Youn Chyung and Shelley A. Berg), The Journal of Effective Teaching (2010)
Research on academic self-regulation suggests that students who are successful in academic settings tend to...
Microstructural Effects During Chemical Mechanical Planarization of Copper (with Patrick J. Andersen, Mariela N. Bentancur, and Megan Frary), Journal of the Electrochemical Society (2010)
Novel die-stacking schema using through-wafer interconnects require vias to be filled with electroplated Cu, resulting...
Successes of an Engineering Residential College Program within an Emerging Residential Culture (with Sondra Miller, Pat Pyke, Melissa Wintrow, Cheryl Schrader, and Janet Callahan), ASEE Annual Conference and Exposition, Conference Proceedings (2009)
Boise State University is in the process of transforming from a historically "commuter" campus into...
Effects of Silver Paste Application on Embedded Channels in Low Temperature Co-Fired Ceramics (with D. L. Kellis and D. G. Plumlee), Journal of Microelectronics and Electronic Packaging (2009)
A monopropellant micropropulsion device is being developed in low-temperature cofired ceramics (LTCC). The device uses...
The Party’s Over: Sustaining Support Programs When the Funding is Done (with John Gardner, Pat Pyke, Cheryl Schrader, and Janet M. Callahan), Conference Proceedings of ASEE Annual Conference and Exposition (2008)
In the lifecycle of an engineering education grant, the phase where best practices are sustained...
Thermal Stability of Cu-Sn Metal-Metal Interconnects (with Jemima Fernandez and Megan Frary), 2008 TMS Annual Meeting (2008)
Cu-Sn is currently being investigated as an alternative to Pb-Sn solders. It is especially interesting...
Integrating Through-Wafer Interconnects With Active Devices and Circuits (with Jim Jozwiak; Richard G. Southwick, III; Vaughn N. Johnson; and William B. Knowlton), IEEE Transactions on Advanced Packaging (2008)
Through wafer interconnects (TWIs) enable vertical stacking of integrated circuit chips in a single package....
Development and Simulation of an Embedded Hydrogen Peroxide Catalyst Chamber in Low-Temperature Co-Fired Ceramics (with Donald Plumlee and Judi Steciak), International Journal of Applied Ceramic Technology (2007)
Satellites in the range of 10–50 kg require small propulsion devices to perform station-keeping tasks...
A Prototype Continuous Flow Polymerase Chain Reaction LTCC Device (with Korey Moeller, Jason Besecker, Greg Hampikian, Donald G. Plumlee, John Youngsman, and Janet M. Hampikian), Materials Science Forum (2007)
There is a growing need for remote biological sensing in both laboratory and harsh field...
Miniature Multi-Electrode Electrochemical Cell in LTCC (with J. Youngsman, B. Marx, S. Wolter, and J. Glass), Journal of Microelectronics and Electronic Packaging (2007)
The miniaturization of analytical instruments and packaging of novel sensors is an area that has...
Chemical Mechanical Planarization for Cu Through-Wafer Interconnects (with P. A. Miranda and J. A. Imonigie), Journal of the Electrochemical Society (2006)
The effects of slurry pH, hydrogen peroxide (H2O2) concentration, and their interactions on a thick...
Low Temperature Co-fired Ceramics for Micro-Fluidics (with John Youngsman, Brian Marx, Martin Schimpf, Scott Wolter, and Jeff Glass), 56th Electronic Components and Technology Conference, 2006. Proceedings. (2006)
The miniaturization of analytical instruments and packaging of novel sensors is an area that has...
Thermo-Mechanical Characterization of Copper Through-Wafer Interconnects (with Peter A. Miranda), 56th Electronic Components and Technology Conference. Proceedings. (2006)
Copper through wafer interconnects (TWIs) have become a viable solution to providing interconnectivity between stacked...
Novel Slurry Solutions for Thick Cu CMP (with Peter A. Miranda, Jerome A. Imonigie, and Aaron L. Erbe), 2005 IEEE Workshop on Microelectronics and Electron Devices (2005)
Electro-plating methods currently used to deposit Cu in through-wafer interconnect applications result in the formation...
Interaction Effects of Slurry Chemistry on Chemical Mechanical Planarization of Electroplated Copper (with Peter A. Miranda and Jerome A. Imonigie), 2004 IEEE Workshop on Microelectronics and Electron Devices (2004)
Recent studies have been conducted investigating the effects of slurry chemistry on the copper CMP...
Polymer Thickness Effects on Bosch Etch Profiles (with C. J.D. Craigie, T. Sheehan, V. N. Johnson, S. L. Burkett, and W. B. Knowlton), Journal of Vacuum Science and Technology B (2002)
Time-multiplexed etching, the Bosch process, is a technique consisting of alternating etch and deposition cycles...
What Do You Do with a B.S. in Materials Science and Engineering? (with W. B. Knowlton), The Journal of Materials Education (2002)
Materials Science and Engineering at Boise State University: Responding to an Industrial Need (with William B. Knowlton, David E. Bunnell, and Susan L. Burkett), Journal of Materials Education (2001)
The College of Engineering at Boise State University (BSU) is a new program in only...
A Materials Researcher on the Manufacturing Floor, Materials Research Society Bulletin (2000)
To enjoy working in manufacturing, one needs to be comfortable with chaos. In fact, it...