Dr. Amy J. Moll joined the College of Engineering faculty at Boise State in 2000,
after earning her M.S. and Ph.D. in Materials Science & Engineering from the
University of California at Berkeley. She gained experience in R&D and manufacturing
of microelectronic materials and packaging while working for Hewlett Packard and Agilent
Technologies for six years. 

At Boise State, Dr. Moll is conducting research in microelectronic packaging. Her funding
has included a project to investigate 3D Technology for Advanced Sensor Systems and the
application of low temperature co-fired ceramic materials (LTCC) to micro analytical and
micro-mechanical systems. Dr. Moll is involved in several grants and projects focused on
improving STEM education at a variety of levels and informing the public about Materials
Science and Engineering. She also serves as a reviewer for journals and textbooks,
including International Journal of Applied Ceramic Technology, International Journal of
Modern Physics B, and Transactions of Industrial Electronics (IEEE).

Articles and Conference Proceedings

Link

On-Chip 3D Inductors Using Thru-Wafer Vias (with Gary VanAckern, R. Jacob Baker, and Vishal Saxena), IEEE Workshop on Microelectronics and Electron Devices (WMED) (2012)

Three-dimensional (3D) inductors using high aspect ratio (10:1); thru-wafer via (TWV) technology in a complementary...

 

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i-STEM Summer Institute: An Integrated Approach to Teacher Professional Development in STEM (with Louis S. Nadelson, Anne Seifert, and Brad Coats), Journal of STEM Education: Innovation and Outreach (2012)

The importance of STEM education to societal developments provides justification for assuring K–12 teachers are...

 

Improving Engineering Students’ Cognitive and Affective Preparedness with a Pre-Instructional E-Learning Strategy (with Seung Youn Chyung, Brian Marx, Megan Frary, and Janet Callahan), Advances in Engineering Education (2010)

During the 2006–2007 academic year, five faculty members from the College of Engineering at Boise...

 

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Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration (with J. M. Lannon Jr., C. Gregory, M. Lueck, A. Huffman, D. Temple, and William B. Knowlton), Proceedings of the SPIE (2010)

The demand for more complex and multifunctional micro systems with enhanced performance characteristics for military...

 

The Role of Intrinsic Goal Orientation, Self-Efficacy, and E-Learning Practice in Engineering Education (with Seung Youn Chyung and Shelley A. Berg), The Journal of Effective Teaching (2010)

Research on academic self-regulation suggests that students who are successful in academic settings tend to...

 

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Presentations

Living in a Materials World: Materials Science and Engineering Professional Development for K-12 Educators (with Louis S. Nadelson and Anne Louise Seifert), 118th ASEE Annual Conference and Exposition (2011)

Advances in materials science are fundamental to technological developments and have broad societal impacts. For...

 

Thermal Stability of Cu-Sn Metal-Metal Interconnects (with Jemima Fernandez and Megan Frary), 2008 TMS Annual Meeting (2008)

Cu-Sn is currently being investigated as an alternative to Pb-Sn solders. It is especially interesting...